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RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish

Shenzhen Bicheng Electronics Technology Co., Ltd
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RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish

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Brand Name : Rogers

Model Number : RO3210

Certification : ISO9001

Place of Origin : China

MOQ : 1PCS

Price : 7.8 USD/PCS

Payment Terms : T/T, Paypal

Supply Ability : 50000pcs

Delivery Time : 2-10 working days

Packaging Details : Packing

Solder Mask Colour : N/A

Copper Weight : 1oz

Customer Support : 24/7 customer support

Shipping Method : DHL/FedEx/UPS/TNT

Thermal Conductivity : 2.0W/MK 75um dielectric material

Analytics : Real-time analytics and reporting

Layer Count : 4-Layer PCB

Board Thickness : 1.6mm

Base Material : RO3210

Min. Hole To Copper : 0.2mm

Fiducial Mark : Through hole

Structure : Stencil foils with aluminum frame

Payment Method : PayPal, T/T

Layers : 1-16

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4-Layer PCB with RO3210, 1.24mm Thickness, and Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of the 4-Layer PCB

This 4-layer rigid PCB is built with Rogers RO3210, a high-frequency circuit material that combines ceramic-filled laminates with woven fiberglass reinforcement, offering improved mechanical stability and uniform electrical performance. The smooth surface of RO3210 is ideal for finer line etching tolerances, ensuring reliability in complex designs.

The immersion gold (ENIG) surface finish provides excellent solderability and long-term corrosion resistance. While no solder mask or silkscreen is applied, the board is designed with precision and tested to IPC-Class-2 standards, guaranteeing quality and reliability.

RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish

2. PCB Construction Details

Parameter Specification
Base Material Rogers RO3210
Layer Count 4 layers
Board Dimensions 60mm x 55mm ± 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Via Type No Blind Vias
Finished Board Thickness 1.24mm
Finished Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Testing 100% tested to IPC-Class-2 standards

3. PCB Stackup

The 4-layer stackup is engineered for high-frequency RF designs, balancing performance and thermal management. Here’s the structure:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35 μm
Core Material Rogers RO3210 0.508mm (20mil)
Copper Layer 2 Copper (1oz) 35 μm
Bonding Layer Prepreg 0.102mm
Copper Layer 3 Copper (1oz) 35 μm
Core Material Rogers RO3210 0.508mm (20mil)
Copper Layer 4 Copper (1oz) 35 μm

4. Features of Rogers RO3210

  • Dielectric Constant (Dk): 10.2 ± 0.5 at 10 GHz, delivering stable signal propagation.
  • Dissipation Factor (Df): 0.0027 at 10 GHz, minimizing signal loss.
  • Decomposition Temperature (Td): 500°C, ensuring reliability in high-heat environments.
  • Thermal Conductivity: 0.81W/mK, providing effective heat dissipation.
  • CTE (Coefficient of Thermal Expansion): X-axis: 13 ppm/°C. Y-axis: 13 ppm/°C. Z-axis: 34 ppm/°C, ensuring dimensional stability and plated-through hole reliability.
  • Flammability Rating: UL 94 V-0, meeting stringent safety standards.
  • Smooth Surface: Ideal for fine line etching tolerances, enabling precise designs.

5. Benefits of RO3210 Material

Mechanical Stability: Woven glass reinforcement improves rigidity and handling, ensuring reliable assembly.

Dimensional Stability: Low CTE provides compatibility with copper and hybrid designs, ensuring high production yields.

High Dielectric Performance: Uniform electrical properties make it suitable for multi-layer, high-frequency structures.

Finer Line Etching: Smooth surface allows for tighter tolerances in complex designs.

Cost-Effective Fabrication: Compatible with standard PTFE processing techniques, reducing production costs.

RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish

6. Applications of the 4-Layer PCB

Automotive Collision Avoidance Systems: Ensures stable signal performance in safety-critical systems.

Automotive GPS Antennas: Provides precision signal transmission for satellite navigation.

Wireless Telecommunications Systems: Ideal for base station infrastructure and broadband wireless communication.

Microstrip Patch Antennas: Suitable for compact, high-performance wireless communication designs.

Direct Broadcast Satellites: Ensures reliability in satellite communication systems.

Datalink and Power Backplanes: Suitable for efficient data transmission and power management systems.

Why Choose Bicheng Technologies?

At Bicheng Technologies Limited, we specialize in manufacturing high-quality PCBs for RF and microwave applications. Our 4-layer PCB with Rogers RO3210 material combines cutting-edge materials and precise manufacturing techniques to deliver reliable performance for your high-frequency designs.

Why Work With Us?

Global Availability: We deliver worldwide and provide excellent customer support.

High Standards: All PCBs are tested to IPC-Class-2 standards for reliable performance.

Customized Solutions: We work closely with you to meet your specific requirements.

If you’re looking for a trusted partner to bring your innovative designs to life, feel free to contact me at sales30@bichengpcb.com. Let’s collaborate to make your next project a success!

RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish


Wholesale RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish from china suppliers

RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish Images

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