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Shenzhen Bicheng Electronics Technology Co., Ltd
RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,
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Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB

Shenzhen Bicheng Electronics Technology Co., Ltd
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Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB

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Brand Name : Bicheng Technologies Limited

Model Number : BIC-0042-V0.80

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 2.99-9.99 PER PIECE

Payment Terms : T/T, Western Union

Supply Ability : 45000 pieces per month

Delivery Time : 10 working days

Packaging Details : Vacuum

Number of Layers : 2

Glass Epoxy : RO3035

Final foil : 1.0 Oz

Final height of PCB : 0.6 mm ±10%

Surface Finish : Immersion gold

Solder Mask Color : N/

Colour of Component Legend : N/A

Test : 100% Electrical Test prior shipment

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Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB

PCB Specifications

PCB SIZE 77 x 65mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components NO
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 0.508mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 6 mil / 6 mil
Minimum / Maximum Holes: 0.4 mm / 5.0 mm
Number of Different Holes: 3
Number of Drill Holes: 57
Number of Milled Slots: 0
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RO3035 0.508mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 0.6 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Data Sheet of Rogers 3035 (RO3035)

RO3035 Typical Value
Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 1025
1006
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 10.2 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes
Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB


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