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Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

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Shenzhen Bicheng Electronics Technology Co., Ltd

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Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

Name: Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold Immersion Tin and Immersion Silver
Brand: Bicheng Enterprise Limited
Price: 2.99 USD

Wholesale Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver from china suppliers

Brand Name : Bicheng Enterprise Limited

Model Number : BIC-102-V8.5

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD2.99-6.99 Per Piece

Payment Terms : T/T, Paypal

Supply Ability : 45000 pieces per month

Delivery Time : 5-6 working days

Packaging Details : Vacuum

Glass Epoxy : RO3210

Final height of PCB : 0.7 mm ±0.1mm

Final foil external : 1.0oz

Surface Finish : Immersion Gold

Solder Mask Color : Green

Colour of Component Legend : White

Number of Layers : 2

Test : 100% Electrical Test prior shipment

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Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,
Today we’re talking about RO3210 high frequency PCBs.

RO3210 high frequency circuit laminates are ceramic-filled laminates reinforced with woven fiberglass. RO3210 material was designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic-- improved mechanical stability.

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

Features and benefits are as follows:
1. Woven glass reinforcement, improves rigidity for easier handling.
2, Uniform electrical and mechanical performance, is ideal for complex multi-layer high frequency structure.
3. Low in-plane expansion coefficient matches to copper, which is reliable for surface mounted assemblies; which is suitable for use with epoxy multi-layer board hybrid designs.
4. Excellent dimensional stability, results in high production yields.
5. Surface smoothness, allows for finer line etching tolerance.

Our PCB Capability (RO3210)

PCB Material:	Ceramic-filled Laminates
Designation:	RO3210
Dielectric constant:	10.2 ±0.5 (process)
Dielectric constant:	10.8 (design)
Layer count:	2 Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	25mil (0.635mm), 50mil (1.27mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Double layer RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

Typical applications
1. Automotive collision avoidance systems.
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellite
6. LMDS and wireless broadband
7. Microstrip patch antennas for wireless communications
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

The basic colour of RO3210 PCB is white.

The manufacturing process of RO3210 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.

Appendix: Data sheet RO3210

RO3210 Typical Value
Property	RO3210	Direction	Units	Condition	Test Method
Dielectric Constant, ε Process	10.2±0.5	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, ε Design	10.8	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor, tanδ	0.0027	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-459	Z	ppm/℃	10 GHz 0℃to 100℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.8	X, Y	mm/m	COND A	ASTM D257
Volume Resistivity	10³		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10³		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	579 517	MD CMD	kpsi	23℃	ASTM D 638
Water Absorption	＜0.1	-	%	D24/23	IPC-TM-650 2.6.2.1
Specific Heat	0.79		j/g/k		Calculated
Thermal Conductivity	0.81		W/M/K	80℃	ASTM C518
Coefficient of Thermal Expansion (-55 to 288℃)	13 34	X,Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃	TGA	ASTM D3850
Density	3		gm/cm³
Copper Peel Strength	11		pli	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver Images

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