Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate

Announcing Our New Go-To Substrate for High-Performance RF Design - Rogers RO3010

We're excited to introduce RO3010, Rogers' latest laminate material perfectly tailored for pushing the boundaries of RF circuit design. This innovative substrate delivers unmatched thermal and electrical stability to help unleash your boldest innovations.

Dimensional Precision

With industry-leading dimensional stability from -40°C to 500°C, RO3010 ensures ultra-precise performance even under extreme operating conditions. Its ceramic-composite construction delivers Cohen's thermal expansion as low as 11-16ppm/°C, virtually eliminating warping concerns.

Pristine Signal Integrity

Dielectric constant of 10.2 and losses below 0.0022 up to 10GHz provide sparkling clean signal transmission. Complex multilayer circuits benefit from RO3010's ability to maintain tight impedance tolerances at high frequencies.

Advanced Thermal Management

Thermal conductivity of 0.95W/mK efficiently dissipates heat, protecting temperature-sensitive components. Its composition also withstands short thermal excursions outside rated ranges.

Cutting-Edge Manufacturing

Prototypes use our standard 35μm copper 2-layer stackup with 0.635mm RO3010 core. Multi-layer designs are happily accommodated as well. All boards receive IPC Class 2 processing including immersion silver finishing.

Contact the Experts

Push your designs to new frontiers with RO3010 as your foundation. Reach out for custom multilayer configurations, volume pricing or application support from our experienced engineering team. Let's help maximize your innovation's potential.

Rogers RO3010 PCB 2-layer 1oz copper High-Frequency RF Substrate Images