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Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick

Shenzhen Bicheng Electronics Technology Co., Ltd
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Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick

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Brand Name : Bicheng Technologies Limited

Model Number : BIC-xxx-V1.36

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 2.88-6.99 per piece

Payment Terms : T/T, Paypal

Supply Ability : 45000 pieces per month

Delivery Time : 4-5 working days

Packaging Details : Vacuum

Number of Layers : 2 Layer, Multilayer

Glass Epoxy : RT/duroid 6002

Final height of PCB : 10mil (0.254mm), 20mil (0.508mm) 30mil (0.762mm), 60mil (1.524mm)

Final foil external : 0.5oz, 1oz, 2oz

Surface Finish : Bare copper, HASL, ENIG, OSP etc..

Solder Mask Color : Green, Black, Blue, Yellow, Red etc.

Colour of Component Legend : Green, Black, Blue, Yellow, Red etc.

Test : 100% Electrical Test prior shipment

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Hello everyone,
Today, we talk about the high frequency PCB made on RT/duroid 6002 material.

The RT/ duroid ® 6002 microwave material is a kind of low loss and low dielectric constant laminate, which can meet the strict requirements for mechanical reliability and electrical stability in complex microwave structural design. The main components are PTFE ceramics composites.

The dielectric constant of RT/duroid ®6002 has excellent resistance to temperature change between -55 ℃ and 150 ℃, which can meet the requirements of filter, oscillator and delay line application design for its electrical stability.
Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick

The main advantages are:
Firstly, low loss ensures excellent high Frequency performance
Secondly, excellent mechanical and electrical properties, reliable multi-layer board construction.
Thirdly, extremely low thermal coefficient of dielectric constant,ensure excellent dimensional stability.
Fourthly, in-plane expansion coefficient matched to copper, allows for more reliable surface mounted assemblies.
Fifthly, low outgassing, ideal for space applications
Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick

Typical applications are:
Phased Array Antennas
Round Based and Airborne Radar Systems
GPS antennas
Power Backplanes
Commercial Airline Collision Avoidance

The base copper of RT/druoid PCB has 0.5oz, 1oz and 2oz; the thickness of PCB board is wide, ranging from 5mil to 120mil to be considered by our designers.

PCB Capability (RT/duorid 6002)

PCB Material:Ceramic-filled PTFE composite
Designation:RT/duroid 6002
Dielectric constant:2.94 ±0.04 (process)
2.94 (design)
Layer count:2 Layer, Multilayer
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm)
30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
  


The basic colour of RT/duroid 6002 PCB is white.

RT/duroid 6002 PCB is very suited to the equipment of flat and non-planar structures, such as antennas, complex multi-layer circuits with inner-layer connections, and microwave circuits for aerospace designs in hostile environments.

If you have any questions, please feel free to contact us. Thank you for your reading.

Appendix:

RT/duroid 6002 Typical Value
PropertyRT/duroid 6002DirectionUnitsConditionTest Method
Dielectric Constant,εProcess2.94±0.04Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign2.94 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0012Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+12Zppm/℃10 GHz 0℃-100℃IPC-TM-650 2.5.5.5
Volume Resistivity106ZMohm.cmAASTM D 257
Surface Resistivity107ZMohmAASTM D 257
Tensile Modulus828(120)X,YMPa(kpsi)23℃ASTM D 638
Ultimate Stress6.9(1.0)X,YMPa(kpsi)
Ultimate Strain7.3X,Y%
Compressive Modulus2482(360)ZMPa(kpsi) ASTM D 638
Moisture Absorption0.02 %D48/50IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity0.6 W/m/k80℃ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
16
16
24
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.41
Td500 ℃ TGA ASTM D 3850
Density2.1 gm/cm3 ASTM D 792
Specific Heat0.93(0.22) j/g/k
(BTU/ib/OF)
Calculated
Copper Peel8.9(1.6) Ibs/in.(N/mm) IPC-TM-650 2.4.8
FlammabilityV-0 UL 94
Lead-free Process CompatibleYes






































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