Announcing Our Latest High-Performance Circuit Boards
We're thrilled to share that we've recently fabricated a pair of cutting-edge printed circuit assemblies designed for reliability in extreme operating environments.
Crafted from an advanced AD255C substrate providing exceptional signal integrity up to 6GHz, even at temperatures spanning -40°C to 85°C, these dual-layer boards feature The substrate's low-loss dielectric properties are due to its woven glass-reinforced PTFE construction.
With specifications such as 78.58mm × 60.16mm dimensions, 3/4 mil minimum tracings and vias as small as 0.3mm, these boards push the limits of miniaturized component placement and routing density. Their 1.14mm stiffness is fortified by a full ounce of copper cladding both internally and externally, with protected interconnects thanks to immersion gold surfacing.
| Specification |
Value |
| Board Dimensions |
78.58mm x 60.16mm=2 Types=2 PCS, +/- 0.15mm |
| Minimum Trace/Space |
3/4 mils |
| Minimum Hole Size |
0.3mm |
| Blind/Buried Vias |
No |
| Finished Board Thickness |
1.14mm |
| Finished Cu Weight (all layers) |
1 oz (1.4 mils) |
| Via Plating Thickness |
1 mil |
| Surface Finish |
Immersion Gold |
| Top Silkscreen |
No |
| Bottom Silkscreen |
No |
| Top Solder Mask |
Green |
| Bottom Solder Mask |
No |
Housing a mere 27 discrete parts connected through 41 total terminals, the efficient designs leverage only 31 intermediary vias to service 3 unique circuits - a testament to expert engineering.
Adhering faithfully to IPC standards from the client's Gerber files through production, our skilled artisans ensured total electrical integrity under strenuous validation testing.
If you have any other inquiries, please be in touch with Sally Mao to discuss how we might help advance your cutting-edge projects. We look forward to future collaborations for pushing technological boundaries.
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40mil AD255C 2-layer rigid PCB Woven Glass Reinforced PTFE DK 2.55 NiAu Images
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