White Solder Mask Single PCB Fabrication FR4 , LED Light Circuit
|PCB SIZE||195 x 192mm=2PCS|
|BOARD TYPE|| |
|Number of Layers||Single sided PCB, 1 layer PCB|
|Surface Mount Components||YES|
|Through Hole Components||NO|
|LAYER STACKUP||Copper ------- 35um(1oz) TOP layer|
|FR-4 1.5 mm|
|Minimum Trace and Space:||7mil/7mil|
|Minimum / Maximum Holes:||0.6/7.2mm|
|Number of Different Holes:||2|
|Number of Drill Holes:||19|
|Number of Milled Slots:||0|
|Number of Internal Cutouts:||0|
|BOARD MATERIAL|| |
|Glass Epoxy:||FR-4 1.5mm, Tg>130℃|
|Final foil external:||1oz|
|Final foil internal:||0oz|
|Final height of PCB:||1.6mm ±0.16|
|PLATING AND COATING|| |
|Surface Finish||Hot air soldering leveling(HASL),lead free, Sn>=2.54µm|
|Solder Mask Apply To:||Bottom, 12micron Minimum|
|Solder Mask Color:||White,PSR400 WT02|
|Solder Mask Type:||LPSM|
|Side of Component Legend||Bottom|
|Colour of Component Legend||Black|
|Manufacturer Name or Logo:||No special requirement|
|VIA||Non Plated Through Hole(NPTH)|
|FLAMIBILITY RATING||UL 94-V0 Approval MIN.|
|DIMENSION TOLERANCE|| |
|Outline dimension:||0.0059" (0.15mm)|
|Board plating:||0.0030" (0.076mm)|
|Drill tolerance:||0.002" (0.05mm)|
|TEST||100% Electrical Test prior shipment|
|TYPE OF ARTWORK TO BE SUPPLIED||email file, Gerber RS-274-X, PCBDOC etc|
|SERVICE AREA||Worldwide, Globally.|
a) Single sided design with competitive price.
b) Epoxy glass FR-4 grade. UL94V0 flame retardant.
c) HASL lead finish for pads. Excellent wetting during component
soldering and it can avoid copper corrosion.
d) Customer complaint rate: <1%
e) DDU Door to door shipment with competitive shipping cost.
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PCB knowledge: The components of multilayer PCB --- Prepreg
A multilayer board consists of copper foils, thin rigid laminates
and prepreg sheets.
Prepreg plays a role of bonding material used for bonding the
individual thin laminates of the multilayer boards. It consists of
glass cloth impregnated with epoxy resin. Unlike rigid laminates,
the epoxy resin is only semi-cured. Epoxy resin is referred to as
B-stage when semi-cured.
The prepreg sheets are not sticky. During lamination of the board,
the epoxy resin is first changed to a liquid state and later in the
press cycle to the fully cured state. During the press cycle, the
cured epoxy resin in the thin, rigid laminates softens, but it does
not become liquid.
Thicknesses of Prepreg sheets
|Glass Fabric Style||Pressed Thickness||Resin Content|
The pressed thickness varies from one manufacturer to another. As
long as the PCB designer does not know the brand(s) of the glass
fabrics used by the multilayer board manufacturer, it is more or
less impossible to specify a detailed build-up. Therefore, this
should be left to the manufacturer.
When a board is required impedance control, the thickness of the
dielectric material between the individual layers become important
and thickness and tolerance are usually specified by designer.
The minimum thickness of the dielectric material (thin laminate or
prepreg sheets) is 75 µm (3 mils) and, in some cases, 100 µm (4
How to order PCBs?
1st step, sending your gerber files for quotation.
2st step, placing your order form to our market department and make
3rd step, Our CADCAM department dealing with your gerber files,
sending you EQ (if it has) for final confirmation.
4th step, PCB manufacturing.
5th step, Shipment and send you tracking number.