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2 Layer Black PCB 1.53-1.62mm Thick 42.02um Copper Thick FR -4 ITEQ 100% Test Pass

BICHENG ENTERPRISE LIMITED
BICHENG ENTERPRISE LIMITED
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-27374847
Contact Person:
Miss Wency Wen

2 Layer Black PCB 1.53-1.62mm Thick 42.02um Copper Thick FR -4 ITEQ 100% Test Pass

Brand Name : Bicheng
Model Number : BIC-1107-A
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Type : FR-4
Board thickness : 1.60±10% mm
Marking form : NA
Color : Black
Forming : V-cut
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2 Layer Black PCB 1.53-1.62mm Thick 42.02um Copper Thick With Immersion Gold FR-4 ITEQ 100% Test Pass


Specification

ItemRequirementResultACCREJ
LaminateTypeFR-4FR-4
SupplierITEQITEQ
Board thickness1.60±10% mm1.53-1.62 mm
Outer copper foil>=35 um42.02um
Inner copper foil//
Warp-twist<= 0.75%0.51%
legendTypeKUANG SHUNKUANG SHUN
ColorWhiteWhite
LocationCSCS
MarkingCo.logoYESOK
UL.logoYESOK
Date codeWWYYWWYY
Marking formNAOK
LocationCSCS
Min line width (mil)6.56.7
Min line spacing (mil)10.810.6
Min ring width (mil)NANA/
Solder MaskTypeKSM-S6189BK31KSM-S6189BK31
ColorBlackBlack
Thickness>=10 um14 um
Pencil Test6H OR ABOVEOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentImmersion GoldOK
Special TreamentSilk screen//
Location//
FormingV-cutOK
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012BOK
Solderability Test245℃ 5S 1 CycleOK

Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.950±0.076Y0.9500.9250.9750.950
23.200±0.08N3.2003.1753.2253.200
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
1120.00±0.15119.98120.11119.93120.05
280.00±0.1580.0779.9379.9080.07
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points110All Open TestQualified
Failure
The first pass Qty558All short TestQualified
Failure
Reject Qty2 pcsThe first pass Rate100%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others2 PCSRepaired Qty0 PCSScrap2 PCS
Remark:

Microsection Analysis Report
purpose & ReqHole wallTrace
Copper20 umSurface copper35 um
Nickel0 umBase copper17 um
Au0 umV/X
Tin/Lead3.92 um
Roughness25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
125.50524.30524.36526.00525.28524.91525.06420.81920.919
224.96523.76523.82525.46524.74524.37524.52315.32715.427
324.70723.50723.56725.20724.48724.11724.26519.55819.658
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAu THKSpeciment Location
140.7518.1412.034.22
242.7917.5813.647.22
342.5116.7615.125.22
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages

1.Focus on your core competencies: We’ve deeply known it is full of fierce competition for our customers in the market. You can focus on such important competencies asresearch and development, sales and marketing based on our professional performance and skilled services that exceeding your expectation.

2.Avoid hassle: It’s an upset matter when quality problem hassling you. Bicheng engineering design prevents problem from occurring in pre-production. You will not get headache with Bicheng’s prototypes, small orders and volume production. Our rate of customer complaint is less than 1%.


More Appliaction

Car Tracking
Plc Basics
Fleet Tracking
Electronic Board
Plc Omron
Led Light Box
Access Control Panel
Led Light Fittings
Video Surveillance Systems
Gigabit Switches
Wireless Adapters
Dc Ac Inverter
Ac Power Supply
3G Wifi


Development

Printed circuit board develops from single sided to double sided, multilayer and flexible, and still maintain their own development trends. Due to the continuous development of high precision, high density and high reliability, and constantly reduce the volume, reduce costs, improve performance, making the printed circuit board in the future development of electronic equipment, still maintained a strong vitality.

Review on the future development trend, the manufacturing technology of PCB mainly is consistent, namely high density, high precision, small diameter, thin track, fine pitch, high reliable, multilayer, high-speed transmission, light weight, thin direction. To improve productivity, reduce costs, reduce pollution, adapt to many varieties and small batch production are the production.



FAQ

1.Do you offer Mass production?
Yes. We have the independent industrial plant. There're 15000 square meters workshop area. And the brand new automatic equipment were introduced from Israel, Germany, Japan and Taiwan area. As of now, the manufacturing capability for 2-12 layer PCBs is 300 thousand square feet per month. 5000 types of different PCBs are shipped to worldwide each month.

2.What information is required for a quote?
Please send us your gerber files, PCB fabrication notes and panel drawing data when you request for quote. This will give you an accurate price in a short time.



Product Tags:

circuit board prototyping

      

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2 Layer Black PCB 1.53-1.62mm Thick 42.02um Copper Thick FR -4 ITEQ 100% Test Pass Images

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