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4 Layer 2.4mm Thick Double Sided Pcb 2oz Outer Layer 1oz Inner Layer

BICHENG ENTERPRISE LIMITED
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4 Layer 2.4mm Thick Double Sided Pcb 2oz Outer Layer 1oz Inner Layer

Brand Name : Bicheng
Model Number : BIC-9587-V
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Laminate Type : FR4:CTI:175V-249V
Finished thickness : 2.36+/-0.236 MM
Inner layer Cu Thickness : 1/1 OZ
Material type : R-500BL
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4 Layer 2.4mm Thick Double Sided Pcb 2oz Outer Layer 1oz Inner Layer


Specifications


ItemDescriptionRequirementActualResult
ACCREJ
LaminateLaminate TypeFR4:CTI:175V-249VFR4:CTI:175V-249VACC
SupplierSHENGYISHENGYIACC
TgTG >135TG >135ACC
Finished thickness2.36+/-0.236 MM2.28 MMACC
Plating thicknessPTH Cu thickness20 um22.32umACC
Inner layer Cu Thickness1/1 OZ1/1 OZACC
Surface Cu thickness70um83.5 umACC
Solder MaskMaterial typeR-500BLR-500BLACC
SupplierOnstaticOnstaticACC
ColorGreenGreenACC
Single / both sidesBoth SidesBoth SidesACC
S/M thickness>= 10.0 um27.43umACC
3M tape testNO Peel Offno peel offACC
LegendMaterial typeS-380WS-380wACC
SupplierTai yoTai yoACC
ColorWhiteWhiteACC
LocationBoth SidesBoth SidesACC
3M tape testNo peel offno peel offACC
CircuitTrace Width (mm)0.635+/-20%mm0.614mmACC
Spacing (mm)0.38+/- 20%mm0.342 mmACC
IdentificationUL markYESOKACC
Company LogoYESOKACC
Date codeWWYYWWYYACC
Mark locationNAOKACC
Surface treatmentHard GoldNickel
Gold
Gold fingerGF Nickel
GF Gold
Immersion silver
immersion tin
HASL
Lead- free HASL1-40um5.78umACC
OSP
Reliabilty TestsThermal shock test288±5℃, 10sec ,3 cyclesNO Discolor , NO DelaminationACC
solder abllity test245±5℃100% wettingACC
FunctionElectrioal Test100%passACC
StandardIPC-A 600H class 2, IPC_6012C CLASS 2100%PassACC
AppearanceVisual inspection100%PassACC
warp and twist<= 0.75%0.23%ACC
OthersV-Cut thickness
Angle

Outline Dimension Report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTH/NPTHActual dimensionACCREJ
10.635+/-0.075Y0.5750.7000.7000.700ACC
20.762+/-0.075Y0.8250.7750.7500.700ACC
30.850+/-0.075Y0.9000.9000.8250.775ACC
40.889+/-0.075Y0.9000.9000.9500.900ACC
51.016+/-0.075Y0.9501.0751.0000.950ACC
61.092+/-0.075Y1.1251.1501.0751.150ACC
71.143+/-0.075Y1.2001.0751.1501.100ACC
81.270+/-0.075Y1.3251.3251.3001.325ACC
91.397+/-0.075Y1.4251.4501.4501.450ACC
101.524+/-0.075Y1.5751.4501.4751.450ACC
111.524+/-0.075Y1.4501.4501.5751.575ACC
121.651+/-0.075Y1.6501.7251.6251.600ACC
131.753+/-0.075Y1.7751.7251.7751.825ACC
141.829+/-0.075Y1.8001.9001.9001.800ACC
151.981+/-0.075Y2.0002.0501.9501.975ACC
162.057+/-0.075Y2.1252.1002.0502.025ACC
172.159+/-0.075Y2.1002.1002.2252.200ACC
182.921+/-0.075Y2.9752.8502.9752.975ACC
193.175+/-0.075Y3.2253.1753.2253.150ACC
203.962+/-0.075Y4.0253.9253.9504.025ACC
214.572+/-0.05N4.5254.6004.5754.550ACC
224.750+/-0.05N4.8004.7754.7004.800ACC
235.588+/-0.05N5.6255.5755.5505.625ACC
247.15+/-0.075Y7.0757.1757.2257.225ACC
Outline dimension unit:(mm, tolerance +/-0.13mm)
NORequiredActual dimensionACCREJ
1228.6+/-0.13228.47228.57228.47228.54228.47ACC
23.18+/-0.133.083.163.083.133.08ACC
3375.92+/-0.13375.79375.89375.79375.86375.79ACC
ACC
Reference engimeering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

Microsection Report
1. Hole Wall Copper thickness (um)Hole wall Roughness<= 25.4 um
Hole wall Copper Thickness20um
Hole wall Position (um)ABCDEFAveDrilPlate
12620.5232320.332222.4713.972.54
22220.4222620.3321.522.042.542.54
32320.33222620.332322.4413.9717.78
2.Surface & Inner layer Cu Thickness & Dielectric Thickness (um)
Layer NO.RequiredResultDescriptionLayer NO.Requirement thicknessresultDescription
NO1NO2NO3NO4
L13583.5ACCL1-L2685678.2ACC
L23564.2ACCL2-L3710713.2ACC
L33563.5ACCL3-L4685678.4ACC
L43584.2ACC
3.Solder mask Thickness
On Laminateconductor surfaceconductor cornerDescription
Measurement Result39.626.516.2ACC

Advantages

1.ENIG -abcde:
a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
b) Good oxidation resistance and good heat dissipation.
c) Long storage time ( It can be stored for more than 1 year in vacuum bag)
d) High solderability, no stressing of circuit boards and less contamination of PCB surface.
e) SMT process is resistant to reflow soldering, resistant to rework.

2.No MOQ, low cost for small quantity prototypes and samples.
3. No minimum order quantity. 1-10 pieces are offered for sale.


More Application

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Shipping method:

By DHL, UPS, FedEx, TNT using clients account (for prototypes)

The forwarder agent of DHL, UPS, FedEx, TNT in Shenzhen

We can ship parcel by Russia special airline for Russian customer

By sea or air for mass quantity according to customer's requirements

By customer's forwarder



FAQ

Do you sell high temperature PCB?
Yes. The material stability of high Tg (glass transition temperature) is high so that a high Tg PCB can be desirable. Multilayer and high layer PCB uses this material much.


Product Tags:

circuit board prototyping

      

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