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HASL Multilayer PCB Green Solder Mask Panel PCB V-cut Routing PCB Inner Layer 0.5oz FR4

BICHENG ENTERPRISE LIMITED
BICHENG ENTERPRISE LIMITED
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-27374847
Contact Person:
Miss Wency Wen

HASL Multilayer PCB Green Solder Mask Panel PCB V-cut Routing PCB Inner Layer 0.5oz FR4

Brand Name : Bicheng
Model Number : BIC-5012-C
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Inner copper foil : H/H OZ
Surface treament : Lead Free HASL
Forming : V-CUT
Electrical test : 100% PCB passed
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HASL Multilayer PCB Green Solder Mask Panel PCB V-cut Routing PCB Inner Layer 0.5oz FR4


Specifications

ItemRequirementResultACCREJ
LaminateTypeFR-4FR-4
SupplierITEQITEQ
Board thickness1.60±10% mm1.57-1.64 mm
Outer copper foil>=35 UM42.99
Inner copper foilH/H OZH/H OZ
Warp-twist<= 0.75%0.09%
legendTypeKUANG SHUNKUANG SHUN
ColorWhiteWhite
LocationCS & SSCS & SS
MarkingCo.logoYESOK
UL.logoYESOK
Date codeWWYYWWYY
Marking formNAOK
LocationCSCS
Min line width (mil)88.2
Min line spacing (mil)54.8
Min ring width (mil)NANA/
Solder MaskTypeKUANG SHUNKUANG SHUN
ColorGreenGreen
Thickness>=10 um13um
Pencil Test6H or AboveOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentLead Free HASLOK
Special TreamentSilk screen//
Location//
FormingV-CUTOK/
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012BOK
Solderability Test245℃ 5S 1 CycleOK

Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.800±0.076Y0.8000.7750.8250.800
21.200±0.05N1.2001.1751.2251.200
32.200±0.076Y2.2002.1752.2252.200
43.180±0.05N3.1753.1503.2003.175
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
1125.00±0.15124.91125.09125.09125.02
260.00±0.1560.0159.8860.0360.10
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points286All Open TestQualified
Failure
The first pass Qty133All short TestQualified
Failure
Reject Qty2 pcsThe first pass Rate69%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others2 PCSRepaired Qty0 PCSScrap2 PCS
Remark:
After take delivery of goods stock over a month of plank demand bake 150 degree+2 hour.
PCB stored environment:22+/-3 degrees, humidity:50+/-10%
Sweet hint: plank more than 6 month (half year) suggestion stop usage.

Microsection Analysis Report
purpose & ReqHole wallTrace
Copper20 umSurface copper35 um
NI0 umBase copper11 um
Au0 umT/L
Tin/Lead3.92 umV/X
Roughness25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
124.38323.18323.24324.88324.16323.79323.94213.77913.879
224.60623.40623.46625.10624.38624.01624.16419.71919.819
325.74624.54624.60626.24625.52625.15625.30521.39021.490
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAu THKSpeciment Location
142.7611.6012.013.93
243.3212.813.866.93
342.8911.713.114.93
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages

1.Products and Manufacturing are certified by authorized organizations.
2. 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
3. Eligible products rate of first production: >95%
4. Delivery on time: >98%


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The components of multilayer PCB: Prepreg

A multilayer board consists of copper foils, thin rigid laminates and prepreg sheets.


Prepreg plays a role of bonding material used for bonding the individual thin laminates of the multilayer boards. It consists of glass cloth impregnated with epoxy resin. Unlike rigid laminates, the epoxy resin is only semi-cured. Epoxy resin is referred to as B-stage when semi-cured.


The prepreg sheets are not sticky. During lamination of the board, the epoxy resin is first changed to a liquid state and later in the press cycle to the fully cured state. During the press cycle, the cured epoxy resin in the thin, rigid laminates softens, but it does not become liquid.


Thicknesses of Prepreg sheets

Glass Fabric StylePressed ThicknessResin Content
 mmmil%
7628H(7630)0.2138.450
7628(43%)0.1957.643
7628(41%)0.1857.341
2116HR0.1355.357
21160.124.752
21130.1456
10800.076364
10600.05271

The pressed thickness varies from one manufacturer to another. As long as the PCB designer does not know the brand(s) of the glass fabrics used by the multilayer board manufacturer, it is more or less impossible to specify a detailed build-up. Therefore, this should be left to the manufacturer.

When a board is required impedance control, the thickness of the dielectric material between the individual layers become important and thickness and tolerance are usually specified by designer.


The minimum thickness of the dielectric material (thin laminate or prepreg sheets) is 75 µm (3 mils) and, in some cases, 100 µm (4 mils).



FAQ

Do you sell flexible PCB (FPC)?
Yes, we offer flexible printed circuits (FPC) with single sided and double sided. Immersion gold and OSP are usually used for this flexible boards.


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