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10up per Panel Matt Blue PCB Immersion Gold PCB Slots with V-cut Routing Milling and Tooling Strips

BICHENG ENTERPRISE LIMITED
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10up per Panel Matt Blue PCB Immersion Gold PCB Slots with V-cut Routing Milling and Tooling Strips

Brand Name : Bicheng
Model Number : BIC-4562-B
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Pencil Test : 6H OR ABOVE
TAPE TEST : NO PEEL OFF
Electrical test : 100% PCB passed
Forming : V-cut
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10up per Panel Matt Blue PCB Immersion Gold PCB Slots with V-cut Routing Milling and Tooling Strips


Specifications

ItemRequirementResultACCREJ
LaminateTypeFR-4 TG170FR-4 TG170
SupplierITEQITEQ
Board thickness1.60±10%mm1.50-1.55 mm
Outer copper foil>=35 um42.08um
Inner copper foil1/1 OZ1/1 OZ
Warp-twist<= 1%0.20%
legendTypeKUANG SHUNKUANG SHUN
ColorWhiteWhite
LocationCSCS
MarkingCo.logoYESOK
UL.logoYESOK
Date codeWWYY1017
Marking formNANA
LocationCSCS
Min line width (mil)66.2
Min line spacing (mil)65.8
Min ring width (mil)NANA/
Solder MaskTypeKSM-6189BLM1KSM-6189BLM1
ColorBlue MattBlue Matt
Thickness>=10 um14 um
Pencil Test6H OR ABOVEOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentImmersion GoldOK
Special TreamentSilk screen//
Location//
FormingV-cutOK
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012BOK
Solderability Test245℃ 5S 1 CycleOK

Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.864±0.076Y0.8750.8500.9000.875
20.914±0.076Y0.9250.9000.9500.925
31.016±0.076Y1.0251.0001.0501.025
41.143±0.076Y1.1751.1501.2001.175
51.524±0.076Y1.5251.5001.5501.525
61.702±0.076Y1.7251.7001.7501.725
72.032±0.076Y2.0252.0002.0502.025
82.540±0.076Y2.5502.5252.5752.550
93.048±0.076Y3.0503.0253.0753.050
103.200±0.076Y3.2003.1753.2253.200
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
1373.30±0.15373.30373.24373.20373.34
2161.62±0.15161.54161.57161.61161.62
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points1823All Open TestQualified
Failure
The first pass Qty118All short TestQualified
Failure
Reject Qty2 pcsThe first pass Rate98%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others2 PCSRepaired Qty0 PCSScrap2 PCS
Remark:

Microsection Analysis Report
purpose & ReqHole wallTrace
Copper20 umSurface copper35 um
Nickel3.6 umBase copper11 um
Au0.05 umV/X
Tin/Lead0 um
Roughness25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
126.68625.48625.54627.18626.46626.09626.24412.88712.987
225.12423.92423.98425.62424.90424.53424.68214.53714.637
325.50824.30824.36826.00825.28824.91825.06613.03413.134
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAu THKSpeciment Location
140.6212.6912.83.810.0504
241.7212.9113.93.840.0534
343.911.4913.923.960.0564
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages

1.ENIG -abcde:
a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
b) Good oxidation resistance and good heat dissipation.
c) Long storage time ( It can be stored for more than 1 year in vacuum bag)
d) High solderability, no stressing of circuit boards and less contamination of PCB surface.
e) SMT process is resistant to reflow soldering, resistant to rework.

2.No minimum order quantity. 1-10 pieces are offered for sale.


More Application

Modem 3G Usb
Constant Current Power Supply
Modem Usb 3G
Power Supply 48V
Ac To Ac Converter
Ac To Dc Transformer
Ac To Dc Inverter
Ac To Dc Converter Circuit
Usb Wireless Router
Mobile Broadband Router
Ac Power Source
Modem Router 3G
Ac Dc Power


Quotation requirement:

Following basic specifications are needed for quotation.

Quantity

Base material

Board thickness

Copper weight (copper thickness)

Surface treatment

Color of solder mask and silkscreen

PCB panel size

Layer count



FAQ

How do you control the quality?
We believe engineering design prevents problems from occurring in preproduction. Our PCB and Manufacturing process are certified by authorized organizations.
100% tests are inclusive of electrical test and AOI inspection, high voltage test, impedance control test, micro-section, solder-ability test, thermal stress test,
reliability test, insulation resistance test and ionic contamination test etc.


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10up per Panel Matt Blue PCB Immersion Gold PCB Slots with V-cut Routing Milling and Tooling Strips Images

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