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Chemical Gold Multilayer PCB FR -4 Tg135 1.6mm Thick 1oz Each Layer

BICHENG ENTERPRISE LIMITED
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Chemical Gold Multilayer PCB FR -4 Tg135 1.6mm Thick 1oz Each Layer

Brand Name : Bicheng
Model Number : BIC-5201-B
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Tg : TG >135
Material type : S-380W
3M tape test : No peel off
warp and twist : <= 0.75%
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6 Layer Chemical Gold PCB FR-4 Tg135 1.6mm Thick 1oz Each Layer 100% Test Passed Green PCB


Specifications

ItemDescriptionRequirementActualResult
ACCREJ
LaminateLaminate TypeFR4:CTI:175V-249VFR4:CTI:175V-249VACC
SupplierSHENGYISHENGYIACC
TgTG >135TG >135ACC
Finished thickness1.6+/-0.16% MM1.618MMACC
Plating thicknessPTH Cu thickness23 um25.78umACC
Inner layer Cu Thickness1/1 OZ1/1 OZACC
Surface Cu thickness35 um56.20 umACC
Solder MaskMaterial typeLP-4G G-05LP-4G G-05ACC
SupplierNan YaNan YaACC
ColorGreenGreenACC
Single / both sidesBoth SidesBoth SidesACC
S/M thickness>=10.0 um27.73 umACC
3M tape testNO Peel Offno peel offACC
LegendMaterial typeS-380WS-380wACC
SupplierTai yoTai yoACC
ColorWhiteWhiteACC
LocationBoth SidesBoth SidesACC
3M tape testNo peel offno peel offACC
CircuitTrace Width (mm)0.254mm0.259mmACC
Spacing (mm)0.19mm0.187mmACC
IdentificationUL markYESOKACC
Company LogoYESOKACC
Date codeWWYYWWYYACC
Mark locationNAOKACC
Surface treatmentENIGNickel100u"113u"ACC
Gold2u"2.14u"ACC
Gold fingerGF Nickel
GF Gold
Immersion silver
immersion tin
HASL
Lead- free HASL
OSP
Reliabilty TestsThermal shock test288±5℃, 10sec ,3 cyclesNO Discolor , NO DelaminationACC
solder abllity test245±5℃100% wettingACC
FunctionElectrioal Test100%passACC
StandardIPC-A 600H class 2, IPC_6012C CLASS 2100%PassACC
AppearanceVisual inspection100%PassACC
warp and twist<= 0.75%0.25%ACC
OthersV-Cut thickness0.4±0.1 mm0.43mmACC
Angle30+/- 530ºACC

Outline Dimension Report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTH/NPTHActual dimensionACCREJ
10.356mmYVIAVIAVIAVIAACC
20.889+/-0.075Y0.8750.9500.8500.900ACC
30.965+/-0.075Y0.9501.0251.0250.900ACC
41.016+/-0.075Y1.0751.0751.0751.075ACC
51.321+/-0.075Y1.2501.3501.3751.250ACC
61.575+/-0.075Y1.5751.5251.6001.625ACC
72.000+/-0.05N2.0752.0502.0501.975ACC
83.175+/-0.075Y3.1253.2003.1003.100ACC
93.327+/-0.075N3.3753.4003.3753.325ACC
Outline dimension unit:(mm, tolerance +/-0.13mm)
NORequiredActual dimensionACCREJ
199.06+/-0.1399.0298.9998.9998.9398.93ACC
269.69+/-0.1369.6569.6369.6369.5669.56ACC
Reference engimeering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

Microsection Report
1. Hole Wall Copper thickness (um)Hole wall Roughness<= 25.4 um
Hole wall Copper Thickness23 um
Hole wall Position (um)ABCDEFAveDrilPlate
126.4523.3829.9026.4523.5726.4526.0313.9717.78
229.9023.4626.4526.4523.3326.4526.012.5417.78
329.9023.5724.7324.7323.5725.3025.3013.9713.97
2.Surface & Inner layer Cu Thickness & Dielectric Thickness (um)
Layer NO.RequiredResultDescriptionLayer NO.Requirement thicknessresultDescription
NO1NO2NO3NO4
L13556.2ACCL1-L2210188.8ACC
L23528.0ACCL2-L310001012.7ACC
L33528.8ACCL3-L4210231ACC
L43557.1ACC
3.Solder mask Thickness
On Laminateconductor surfaceconductor cornerDescription
Measurement Result40.124.218.9ACC

Advantages

1.HASL has: Excellent wetting during component soldering and it can avoid copper corrosion.

2. iteq it-140: RoHS compliant and suitable for thermal reliability needs,and Lead free assemblies with a maximum reflow temperature of 260℃.

3. ITEQ IT-140: It’s suitable for handheld and consumer applications. It’s also Lead free compatible.

4. ITEQ IT-180: Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.


More Application

Neon Power Supply
Embeded System
Pcb Train
Circuit Board Parts
30V Power Supply
Isolated Dc Dc Converter
Embedded Technology
Custom Pcb
Pcb Electronics
Dc Dc Step Up Converter
Pcb Repair
Micro Plc
Plc Program
Pcb Service
Honeywell Access Control


Bicheng Quality Policy (2)

Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.


Control of Production Process

Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.


Final Control and Inspection

All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.


Product Delivery Audit

We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.


FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.


Customer Service

We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers’ demands, timely to adjust the policy of customer service and PCB product requirements.



FAQ

How to Pay?
We accept bank wire transfer, PayPal. It's sorry, we currently do not accept credit card.



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